laird performance materials headquarters

Laird Performance Materials designs and develops electronic device protection solutions, including EMI suppression, thermal management materials, structural and precision metals, and multi-functional products. Mil/Aerospace: Avionics, RF, energy, and microwave components and modules for phased array radar, countermeasures, communications, and other systems, requiring advanced thermal management as well as high-temperature materials and packaging. Non-Members of IMAPS (including those only registered on IMAPS-UK website) will be charged a registration fee of £50 (exc VAT). The Thermal Technologies Workshop is part of the SEMI-THERM Educational Foundation (STEF), which was established in 2013 as a Non-Profit Educational Foundation. Corporate headquarters and logistics center in Mansfield, Texas USA. Newest Products by Laird Performance Materials, Browse all products by Laird Performance Materials. Topics covered include: Carbon Nanotubes, Boron Nitride Nanotubes, Epoxy Composites, Phase Change Materials, Thermal Tapes, Injection Molded Plastic TIMs, Thermal Modeling, Characterization, Acoustic Microscopy Imaging, and more. 2W/m.K thermal conductivity, UL94V-0 flammability rating, and -40°C to +150°C temperature range. Sign up to receive the latest in thermal management techniques, news, and products delivered to your inbox. Plastics have changed the world, enabling our society to enjoy the benefits of products that can be safer, lighter, stronger, cheaper and more practical than other materials. Heilind Electronics, a leading distributor of electronic components, announced today the signing of a global distribution agreement with Laird Performance Materials, a portfolio company of privately held Advent International. Wireless and telecom infrastructure: High-performance telecom hardware have challenging component and system-level requirements that require technical advances to meet the evolving needs for routers, networked systems, and base stations. Find solutions. New logo. Outstanding balance which reflects all unpaid changes due at this time per your selected payment method. Membership of the above organizations will be checked prior to approval of the booking. Laird serves leading names in electronics with innovative thermal interface materials; electromagnetic interference shielding materials and magnetic ceramic solutions; RF and microwave absorbers; precision and structural metals; and industry-leading multifunctional products. Laird Performance Materials (, a portfolio company of Advent International, enables high-performance electronics and creates advanced protection solutions for electronic components and systems. We create advanced protection solutions for electronic components and systems. This Online Conference will cover all aspects of designing, manufacturing, and testing of high thermal performance electronics, where miniaturization, costs, and reliability are critical features that need to be optimized. ... Corporate headquarters and logistics center in Mansfield, Texas USA. Attendees may revisit these presentations after the event via recordings delivered directly to them. View Mobile The global agreement is designed to better serve a wide range of end-users – specifically, through leveraging Heilind’s formidable sales capabilities and broad engineering expertise with Laird’s global footprint of manufacturing sites and engineering teams. In 2019, the Workshop moved to the Microsoft Corporation Conference Center on the Microsoft headquarters campus, near Seattle WA, allowing us to set a new attendance record and expand the number of technical exhibits, with an outstanding response from speakers and attendees. Exhibit booths feature rich, virtual profiles and instant contact with company representatives. Feature grain-oriented and plate-like structure that provides a high thermal conductivity. Laird Performance Materials, an Advent International company with global headquarters in Shanghai, China, enables high-performance electronics. Laird Performance Materials (, a portfolio company of Advent International, enables high-performance electronics and creates advanced protection solutions for electronic components and systems. When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. An abstract submittal page will also be available at a later date on the SEMI-THERM Educational Foundation website ( Laird Performance Materials | 3,288 followers on LinkedIn | We enable high performance electronics. Liquid cooling, phase-change, and refrigeration: Advanced cooling methods that use liquid, latent heat, and/or active cooling provide opportunities for enhanced performance and design flexibility. Duty, customs fees and GST collected at time of delivery. The low profile feature benefits in consumer electronics, industrial, and telecom design. Materials science experts enable improved protection, higher performance and reliability, custom structural designs and faster time-to-market. Each year, authors and attendees find this workshop format to be a highly effective forum for the announcement of new developments and new challenges, as well as for excellent networking between all participants. Data center cooling: Data center cooling includes a variety of design optimization activities including cooling provisioning, airflow control, temperature distribution, and migration paths that range from forced air convection to system liquid cooling. Laird Performance Materials 51H Fabric-over-Foam (FoF) EMI Gaskets provide excellent EMI shielding performance anywhere EMI issues occur. Vadim Gektin, Member Technical Staff, NUVIA, Inc. Bill Maltz, President, Electronic Cooling Solutions, Inc. Nader Nikfar, Principal Thermal Engineer, Qualcomm Technologies, Inc. Adriana Rangel, Mechanical Engineer, Cisco Systems Inc. Dave Saums, Principal, DS&A LLC Tejas Shah, Senior Thermal Architect, Intel Corporation Guy Wagner, Director, Electronic Cooling Solutions, Inc. Ross Wilcoxon, Associate Director, Mechanical Engineering, Mission Systems, Collins Aerosace, Inc. Excellent EMI shielding performance, electrically conductive fabric with a soft urethane foam core. We have largely covered the most common materials and their associated thermal properties used in electronics packaging. Copyright ©2020 Mouser Electronics, Inc. - A TTI and Berkshire Hathaway company. Founded in 1974, Heilind has locations throughout the U.S., Canada, Mexico, Brazil, Germany, Singapore, Hong Kong, and China. All other trademarks are the property of their respective owners. Mouser Electronics Canada - Electronic Components Distributor. Thermal Management and Measurement/Testing, 1: Automotive Electric Power Train Challenges, 5. World-leading technology brands rely on us for improved protection, higher performance and reliability, custom structural designs and faster time-to-market. Laird Plastics has been in the business of successfully distributing plastic sheets, rods, and films for over 70 years. Stacked-die packaging: Advanced packaging technologies, such as System-In-Package, Multi-chip modules, Multi-package modules, and stacked-die packaging provide significant opportunities for miniaturization and performance enhancements. “Heilind fills important needs for our company, and has demonstrated the type of distribution expertise we seek — along with the level of selling skills we require to expand brand preference. Questions may be addressed to Join all your fellow professionals online for a full day of learning and networking! Developing market trends, market segmentation, cost drivers, and reliability factors are examples of topics that set the framework for where and what types of new technical solutions are viable. Thermal interface materials (TIMs) and testing: Advanced thermal interface materials that may include organic, metallic, graphitic materials in bulk form, as well as nanoscale, are enabling significant advances in the thermal management of high-performance processors, memory, telecom, IGBT, RF, and microwave components and systems. Laird Performance Materials EMI Absorbers are offered in two types: magnetic and foam. Manufacturers’ Representative Supporting the Illinois and Wisconsin Electronics Engineering and Manufacturing Community. Heilind Electronics, Inc. ( is one of the world’s leading distributors of connectors, relays, sensors, switches, thermal management and circuit protection products, terminal blocks, wire and cable, wiring accessories and insulation and identification products. Sponsored by Master Bond As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that … Download Now, 10novAll Day13SEMI-THERM Thermal Technologies Workshops. ABSTRACTS ARE SOLICITED IN THE FOLLOWING AREAS: Speakers should submit one copy of a two-paragraph abstract that describes their proposed 25-minute presentation no later than October 9, 2020. Accessibility Effective designs must balance these advantages against factors including life-cycle cost, reliability, and serviceability impact. “We are excited to expand and strengthen our relationship with Laird,” said Alan Clapp, Vice President, Heilind Electronics. Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. Follow Heilind on Facebook at and on Twitter at Networking is done all-day via video conference rooms and through scheduled 1×1 meetings and our networking lobby. Click here to learn more about our Industry Sponsors! Materials science experts enable improved protection, higher performance and reliability, custom structural designs and faster time-to-market. Please visit these categories for more information on. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials. Keynote presentations in the last five years have been given by speakers from AMD, Collins Aerospace, Georgia Institute of Technology, HPE/Hewlett Packard Laboratories, HP Systems Research Labs, IBM Corporation, Intel Corporation, Microsoft, Qualcomm Technologies, Samsung (Korea), Santa Clara University, The Citadel, and the University of Colorado.

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